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- MakaleAçık Erişim2026Scopus SJRQ3Effects of Different Adhesive Ratios on Selected Panel Properties of High-Density Fiberboard (HDF) Produced from Fir and Beech Chips
Çamlıbel, Osman; Ayata, Ümit
High-density fiberboard (HDF) has been utilized in various forest-based industries for centuries. This study investigated the effects of different adhesive ratios on the properties of HDF through a series of tests. The panels, designed in particular for this study, had been produced in a laboratory putting the usage of a combination of 70% fir (Abies nordmanniana subsp. bornmulleriana) and 30% beech (Fagus orientalis L.) fibers sourced from the western Black Sea area of Turkey. Two adhesive levels were tested: 10.73% for panel I and 11.30% for panel II, both calculated based on dry fiber weight. We assessed several physical and mechanical properties, including density, modulus of rupture (MOR), modulus of elasticity (MOE), internal bonding (IB), hardness, water absorption, and through-thickness swell, in accordance with standard testing methods. The results indicated that both adhesive levels produced panels meeting the general performance requirements for HDF. Panel II, which contained slightly more adhesive, demonstrated marginally better performance in specific strength and dimensional stability tests. Overall, the findings suggest that optimizing adhesive usage in industrial HDF production can help establish a balance between the performance requirements of the boards and cost-effectiveness in production.
- MakaleAçık Erişim2024Scopus SJRQ3Effect of Calcium Lignosulfonate Additive on Some Physical and Mechanical Properties of High-Density Fiberboard
Çamlibel, Osman; Ayata, Ümit; Peker, Hüseyin
Calcium lignosulfonate (CLS) (C20H24CaO10S2) is widely used in various industries today, including wood, construction, food, agriculture, and textiles. There are currently few studies on the addition of CLS chemicals to various fiberboards. This study was designed to explore the outcomes of the interaction between CLS and the boards, with the aim of expanding the potential applications of this chemical. We incorporated CLS at varying percentages (6%, 8%, and 10%) as an adhesive ad-ditive in high-density fiberboard (HDF) produced using urea-formaldehyde (UF) resin in a labor-atory setting. We assessed its impact on several physical properties - thickness swelling (TS), den-sity, and water absorption (WA) - and mechanical properties: modulus of rupture (MOR), internal bond strength (IB), modulus of elasticity (MOE), and surface soundness (SS). A control group was created using prepared boards, enabling the comparison of results between boards made with and without CLS additives. According to the results of a multivariate analysis of variance, the CLS per-centage showed no significant effect on density, MOE, and SS. However, it significantly influenced TS, WA, IB, and MOR, resulting in reductions of 4-12% for SS, 6-12% for MOR, and 2-22% for IB, while increasing TS by 20-130%, WA by 25-84%, and MOE by 1-3%. It was observed that the use of CLS led to differing results in the tests conducted on the produced HDF materials.
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