Temperature dependent current- and capacitance-voltage characteristics of W/n-Si structures with two-dimensional WS2 and three-dimensional WO3 interfaces deposited by RF sputtering technique

MakaleYayıncıda açık erişimScopus SJRQ1

Özet

In this study, tungsten disulfide (WS2) and tungsten trioxide (WO3) thin films are deposited on n-Si by RF sputtering technique. The optical, morphological and structural characteristics of these films are investigated. The XRD patterns showed that highly crystallinity have been obtained with dominant characteristic diffraction peaks of the WS2 and WO3. The SEM images show that these films are nearly uniform and covered all surface of substrates. Furthermore, the WS2 film has two-dimensional (2D) vertical layers while the WO3 has three-dimensional (3D) structure. From the XPS spectra, it revealed that the peaks confirmed the formation of WS2 and WO3 phases. The Raman spectra presented that different vibrational modes and phases are characteristics of the WS2 and WO3 thin films. Electrical properties of W/n-Si metal-semiconductor (MS) and W/WS2/n-Si and W/WO3/n-Si metal-interfacial layer-semiconductor (MIS) diodes are investigated using current-voltage (I-V) and capacitance-voltage (C-V) characteristics at various temperatures. It was found that I-V and C-V characteristics are strongly dependent on temperature and the interfacial WS2 and WO3 layers are significant roles for the electrical properties of W/WS2/n-Si and W/WO3/n-Si devices.

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https://rdlopen.rawdatalibrary.net/r/bayburt/13526Resmi atıflarda kullanılan kalıcı adres
DOI
https://doi.org/10.1016/j.mssp.2020.105204Yayıncı resmi DOI adresi
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19
WoS
20
OpenAlex
17
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Tam Kayıt
AlanDeğerDil
dc.contributor.authorBaltakesmez, A.
dc.contributor.authorTekmen, S.
dc.contributor.authorGüzeldir, B.
dc.date.accessioned2026-10-29T19:11:06.197129299Z
dc.date.available2026-10-29T19:11:06.197129299Z
dc.date.issued2020
dc.description.abstractIn this study, tungsten disulfide (WS2) and tungsten trioxide (WO3) thin films are deposited on n-Si by RF sputtering technique. The optical, morphological and structural characteristics of these films are investigated. The XRD patterns showed that highly crystallinity have been obtained with dominant characteristic diffraction peaks of the WS2 and WO3. The SEM images show that these films are nearly uniform and covered all surface of substrates. Furthermore, the WS2 film has two-dimensional (2D) vertical layers while the WO3 has three-dimensional (3D) structure. From the XPS spectra, it revealed that the peaks confirmed the formation of WS2 and WO3 phases. The Raman spectra presented that different vibrational modes and phases are characteristics of the WS2 and WO3 thin films. Electrical properties of W/n-Si metal-semiconductor (MS) and W/WS2/n-Si and W/WO3/n-Si metal-interfacial layer-semiconductor (MIS) diodes are investigated using current-voltage (I-V) and capacitance-voltage (C-V) characteristics at various temperatures. It was found that I-V and C-V characteristics are strongly dependent on temperature and the interfacial WS2 and WO3 layers are significant roles for the electrical properties of W/WS2/n-Si and W/WO3/n-Si devices.
dc.identifier.articlenumber105204
dc.identifier.doi10.1016/j.mssp.2020.105204
dc.identifier.eissn1873-4081
dc.identifier.issn1369-8001
dc.identifier.scopus2-s2.0-85085238462
dc.identifier.urihttps://rdlopen.rawdatalibrary.net/r/bayburt/13526
dc.identifier.volume118
dc.identifier.wosWOS:000552273500004
dc.language.isoen
dc.publisherElsevier Ltd
dc.relation.conferenceSymposium H on Materials for Applications in Photocatalysis and Photoconversion / Spring Meeting of the European-Materials-Research-Society (E-MRS)
dc.relation.ispartofMaterials Science in Semiconductor Processing
dc.rightsinfo:eu-repo/semantics/closedAccess
dc.subjectMetal-semiconductor structures
dc.subjectRF Sputtering
dc.subjectTemperature
dc.subjectTungsten disulfide
dc.subjectTungsten trioxide
dc.subject.classificationEngineering, Electrical & Electronic
dc.subject.classificationMaterials Science, Multidisciplinary
dc.subject.classificationPhysics, Applied
dc.subject.classificationPhysics, Condensed Matter
dc.subject.classificationEngineering
dc.subject.classificationMaterials Science
dc.subject.classificationPhysics
dc.subject.otherCapacitance
dc.subject.otherCrystallinity
dc.subject.otherCurrent voltage characteristics
dc.subject.otherSemiconductor diodes
dc.subject.otherSilicon
dc.subject.otherSulfur compounds
dc.subject.otherThin films
dc.subject.otherTungsten compounds
dc.subject.otherCapacitance voltage characteristic
dc.subject.otherCapacitance-voltage characteristics
dc.subject.otherI-V and C-V characteristics
dc.subject.otherMetal semiconductors
dc.subject.otherStructural characteristics
dc.subject.otherTemperature dependent
dc.subject.otherThree dimensional (3D) structures
dc.subject.otherTwo Dimensional (2 D)
dc.subject.otherSilicon compounds
dc.titleTemperature dependent current- and capacitance-voltage characteristics of W/n-Si structures with two-dimensional WS2 and three-dimensional WO3 interfaces deposited by RF sputtering technique
dc.typeArticle
rdl.citation.openalex17
rdl.citation.scopus19
rdl.citation.wos20
rdl.conference.dateMAY 27-31, 2019
rdl.conference.placeNice, FRANCE
rdl.oa.statusgreen
rdl.oa.statuspreprint
rdl.scopus.quartileQ1
rdl.source.indexSCOPUS
rdl.source.indexWOS
rdl.wos.indexScience Citation Index Expanded (SCI-EXPANDED)
rdl.wos.indexConference Proceedings Citation Index - Science (CPCI-S)